Wafer Metallization Packaging

 
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wafer matallizartion

ASM has over 2000+ Person years of experience in serving reputed Semiconductor ‘Front-End’ and ‘Back-End’ process equipment manufacturing companies. ASM has the expertise and understanding of design & development of System and Sub Systems of: PVD, CVD, RTP, Etch, CMP and related Inspection/ process tools for Wafer Metallization and Packaging.

 

ASM’s Engineering Services across Customer’s spectrum of tools:

  • Design and Development from concept to realization
  • Continuous Improvement projects and Co-Creation
  • Application Software Development and Support
  • Industrial IoT
  • Virtual Reality (VR)
  • Sustenance Engineering
  • Operations support
  • 24/7 Infrastructure/ Network Management and support